Takchip TKP-500W fully automatic wafer plasma cleaning/etching equipment is mainly used for wafer surface cleaning and pretreatment, and is compatible with 6/8/12-inch wafers. TKP-500W is mainly compo
Takchip TKP-100I online plasma cleaning equipment is mainly used for surface treatment in the field of IC packaging. TKP-100I is mainly composed of loading and unloading mechanism, pushing mechanism,
Takchip TKP-300L fully automatic laser marking equipment is mainly used for laser marking processing in the field of IC packaging. TKP-300L is mainly composed of automatic loading and unloading mechan
Takchip SUPREME continuous vacuum sputtering system is mainly used for SiP EMI electromagnetic shielding layer deposition, Fanout RDL seed layer deposition, NPL layer deposition and BSM wafer back met
Takchip Technology Group was established in 2007. In order to achieve the goal of steady development over the past few decades, the company has continuously improved its comprehensive quality on the one hand, and actively expanded its products to SMT peripheral equipment on the other hand, integrating the advantages of products...