Fully automatic laser marking equipment - Suzhou Takchip Semiconductor Co., Ltd.

ADVANTAGES & FEATURES

Multi-size compatibility

Strong compatibility, adapting to workpieces of various sizes and shapes (50-100mm wide, 160-300mm long).
High precision and high reliability

The marking has high precision, fast speed and good stability, meeting the needs of high-quality continuous production.
Independent research and development of the whole machine

Independently develop equipment software and hardware systems to ensure stable and smooth operation of the equipment and more convenient maintenance.
Compliant with semiconductor standards

Support SECS/GEM, two-year log traceability; with processing report, alarm indication and solution prompts and other functions.
Automation and high efficiency

The equipment is fully automatic in production, has high processing efficiency, and has product traceability capabilities.

Laser Marking

Laser markable carrier

Wafer level:
Silicon, glass, ceramic, sapphire, etc.

Strip/L/F/Substrate level:
EMC, metal, etc.

Laser markable content

Text, pattern
Such as: logo, QR code, customized characters

Project	Content
Machine size	320013301810mm (length * width * height)
Loading and unloading mechanism	Slot to Slot, can hold at least three boxes
Suitable for product size	W：50-100mm，L：160-300mm，Warpage：≤ 5mm
Feed track	Track size range 50-100mm (automatically adjustable)
Visual inspection	L/F, front and back side inspection of carrier board
Track dust removal device	Ion fan + brush + vacuum cleaner
Laser marking module	Select laser module according to actual needs (Taiyan TLF, TLG series)
2D code reading mechanism	Identify the strip ID
Dust removal device in marking area	The dust and odor generated by marking are collected and discharged through the dust box
Rear visual inspection	Detection of tag content, location, and effect