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Suzhou Takchip Semiconductor Co., Ltd.
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Inline Plasma

TKP-100I

Online plasma cleaning equipment
Takchip TKP-100I online plasma cleaning equipment is mainly used for surface treatment in the field of IC packaging. TKP-100I is mainly composed of loading and unloading mechanism, pushing mechanism, transfer mechanism and vacuum chamber module, etc. It can be used in the cleaning process before the dispensing and mounting of lead frames, chip bonding and plastic sealing in IC packaging, which can effectively improve the bonding and bonding strength and optimize the packaging yield.
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Online plasma cleaning equipment
ADVANTAGES & FEATURES
  • Strong track adaptability
    Four-track design with adjustable width, can accommodate material strips of 40-84mm, with strong adaptability.
  • Design for safe operation
    The specially made stainless steel cathode rail and anti-stuck structure design provide a stable and safe operating environment.
  • Mature control system
    Adopt mature and stable software control system to ensure stable and smooth operation of equipment and improve work efficiency.
  • High uniformity plasma
    The equipment provides highly uniform plasma concentration to ensure excellent cleaning effect.
  • Flexible production capacity
    The equipment has a wide range of process parameter adjustment and flexible production capabilities.
Replacing electrodes can operate different products, and WCA measurements at different locations are uniform
95 mm ceramic three-rail electrode
Four-track BGA electrode (36.4 mm)
Three-track L/F electrode (76.3mm)
63.4 mm Ceramic Four-Rail Electrode
Three-track BGA electrode (76.3 mm)
Four-track L/F electrode (70 mm)
Six-track BGA electrode (33.6 mm)
The longer the process time, the lower the WCA
Comparison of WCA using (three-track) electrodes
application
Plasma cleaning before wire bonding
Plasma cleaning of L/F before wire bonding can remove contaminants on the product surface, increase surface activity, and enhance adhesion performance.

Before & After Plasma Cleaning

Comparison of tensile test before and after plasma cleaning

Plasma cleaning before molding

No plasma cleaning: poor bonding, easy to fall off

Plasma cleaning: good bonding

application
Project Content
Equipment size 1920*1320*1820mm(length*width*height)
Radio frequency power supply RF1000W，13.56MHz
Vacuum chamber Stainless steel
Vacuum line Stainless steel pipes
Process Gas Ar, O2 optional
Control System PC
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