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Suzhou Takchip Semiconductor Co., Ltd.
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8-inch/12-inch Fully-automatic opposing dual dicing

TKPD-8366

8"/12" dual-axis fully automatic precision dicing machine
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8
ADVANTAGES & FEATURES
  • High power DC spindle
  • Fully automatic dual-axis design
  • High rigidity gantry structure
  • Optical height measurement: non-contact height measurement
  • Fully automatic loading and unloading/UV degumming/centrifugal cleaning
  • CCD dual-lens automatic imaging system
  • Imported roller guide rails and ground-grade lead screws
  • BBD blade breakage/CSP online blade mark detection

Wafer
Integrated circuit
Package substrate
Wafer/Material
application
Project Parameter Project Parameter
Equipment size (W*D*H) (mm) 1288*1618*1810

Processing size (mm)

Φ305-round
Equipment weight (kg) 2000 260*260-Square
Rated power(Kw) 1.5/1.8/2.4 (DC) Customized size
Maximum speed (mm/s) 600 Cutting disc size 12 inches (ceramic)
Cutting straightness 2um Spindle speed (rpm/min) 6000-60000
Microscope (magnification/x) 6X+0.8X (optional 3X/1.5X) Drive System AC Servo Motor
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