Takchip SUPREME continuous vacuum sputtering system is mainly used for SiP EMI electromagnetic shielding layer deposition, Fanout RDL seed layer deposition, NPL layer deposition and BSM wafer back metallization deposition, and is suitable for efficient batch processing of large-size workpieces. SUPREME is mainly composed of loading and unloading chambers, plasma chambers, buffer chambers, sputtering process chambers, etc. Different chamber designs can be provided according to different product application requirements. The deposited film has high uniformity, high hole/sidewall coverage, high adhesion and other performance characteristics.