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Thin Film Deposition
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Thin Film Deposition
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  • TSV and TGV
    TSV and TGV
  • Continuous Vacuum Sputtering System
    Continuous Vacuum Sputtering System
    Takchip SUPREME continuous vacuum sputtering system is mainly used for SiP EMI electromagnetic shielding layer deposition, Fanout RDL seed layer deposition, NPL layer deposition and BSM wafer back met
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