Fully automatic wafer plasma etching equipment - Suzhou Takchip Semiconductor Co., Ltd.

CN / EN

Plasma Etching

TKP-500W

Fully automatic wafer plasma etching equipment

Takchip TKP-500W fully automatic wafer plasma cleaning/etching equipment is mainly used for wafer surface cleaning and pretreatment, and is compatible with 6/8/12-inch wafers. TKP-500W is mainly composed of 6/8/12-inch wafer loading port, dual-arm wafer robot, aligner and vacuum chamber module, which can provide effective solutions for wafer debonding and hole cleaning, wafer adhesion enhancement, metal oxide removal and wafer stress release.

ADVANTAGES & FEATURES

High performance power system

High-performance plasma power system ensures uniformity of erosion and activation.
Compatible with multiple wafer sizes

The equipment is compatible with 6-inch, 8-inch and 12-inch wafers to meet flexible production needs.
Plasma treatment uniformity

Fully automatic plasma chamber design, process optimization, reasonable plasma reaction space and uniform treatment.
Reduce the risk of wafer damage

Equipped with a high-precision dual-arm wafer robot to accurately position the wafer and reduce the risk of wafer damage.
Reduce the risk of wafer damage

The integrated control system design simplifies the operation process, lowers the application threshold, and improves production efficiency.

application

EMC dry etching

Plasma glue removal

Si, SiC, ABF, metal micro-etching

Wafer plasma cleaning

application

Project	Content
Equipment size	190015002100mm（LWH）
Cavity Mode	Side opening
Wafer size	8 inches (compatible with 6 inches, 12 inches) thickness ≥ 200um, warpage ≤ 1mm
Power Configuration	RF1000W、13.56MHz
Process Gas	O2, Ar, N2, CF4 (spare)
Air intake method	Top air intake
Flow Meter	0-300sccm
Vacuum Pump	Dry Pump
Vacuum degree	0.02Torr