Inline Plasma Cleaning Equipment TKP-200 - Suzhou Takchip Semiconductor Co., Ltd.

TKP-200

Inline Plasma Cleaning Equipment TKP-200

The Taiyan TKP-200 inline plasma cleaning system is specifically designed for the IC packaging sector. It is ideally suited for surface cleaning prior to processes such as wire bonding and plastic encapsulation on leadframes and substrates, effectively enhancing product adhesion strength and bonding quality while improving overall product reliability and packaging yield. The TKP-200 features a left-in, left-out configuration and is equipped with highly efficient loading, pushing, and transfer mechanisms; combined with a precisely engineered vacuum chamber module, this design ensures the system's stability and reliability during high-speed operation.

Application

Product Applications

Before Cleaning

After cleaning

Tensile Testing Before and After Plasma Cleaning

Specifications

Parameter	Value	Parameter	Value
RF Power Supply	13.56 MHz, 1000 W	Power Supply	380 V / 30 A / 50 Hz (3P5W)
Vacuum Pump	Dry Pump	Total Equipment Power	≤ 1000 W
Product Dimensions	Length: 160–300 mm, Width: 25–78 mm, Thickness: 0.1–2 mm	Compressed Air	0.4–0.6 MPa
Number of Tracks	4	Process Gas	Standard: Ar; 1 Process Gas Line
UPH	Determined by customer workpiece material, cleaning time, vacuum level, etc.	Line Exhaust	Facility Exhaust
Cleaning Performance	Water Contact Angle Test ≤ 30° (based on lead frames as an example)	Equipment Footprint	L × W: 2000 mm × 2000 mm (A clearance of 400 mm must be maintained between the machine and the wall to accommodate the vacuum pump, exhaust piping, etc.)