Suzhou Takchip Semiconductor Co., Ltd.
6-inch/8-inch semi-automatic single dicing

TKPD-6852

6 inch/8 inch semi-automatic precision dicing machine
6 inch/8 inch semi-automatic precision dicing machine
ADVANTAGES & FEATURES
  • High power spindle
  • Full stroke positioning accuracy 2μm
  • High rigidity mechanical structure
  • Visual auto focus function (optional)
  • Fully automatic loading and unloading/UV degumming/centrifugal cleaning
  • DD motor drives the rotating axis
  • Imported precision guide rails and ground-grade lead screws
  • Online knife mark detection/automatic flange grinding function (optional)

Integrated circuit
Optical glass
Package substrate
Wafer/ceramic
application
Project Parameter Project Parameter
Equipment size (W*D*H) (mm) 795*1108*1732 Processing size (mm) ≤Φ205-round/square
Equipment weight (kg) 680 Cutting disc size 6 inches/8 inches
Rated power(Kw) 1.5 (DC) Maximum spindle speed (rpm/min) 40000
Maximum speed (mm/s) 500 Drive System AC Servo Motor
Cutting straightness 2um Guide Imported high-precision guide rails and ground-grade lead screws
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