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Suzhou Takchip Semiconductor Co., Ltd.
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8-inch/12-inch semi-automatic opposing dual dicing

TKPD-6666

8 inch/12 inch dual axis semi-automatic dicing machine
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8 inch/12 inch dual axis semi-automatic dicing machine
ADVANTAGES & FEATURES
  • High power DC spindle
  • Dual-lens automatic image recognition system
  • High rigidity gantry structure
  • Optical height measurement: automatic height measurement during cutting
  • DD motor drives the rotating axis
  • CSP online knife mark detection
  • Imported roller guide rails and ground-grade lead screws
  • BBD blade breakage detection

Wafer
Integrated circuit
Package substrate
QFN/DFN/Ceramic Basic
application
Project Parameter Project Parameter
Equipment size (W*D*H) (mm) 1080*1160*1810

Processing size (mm)

Φ305-round
Equipment weight (kg) 1200 260*260-Square
Rated power(Kw) 1.8~2.4 (DC) Customized size
Maximum speed (mm/s) 600 Cutting disc size 8 inches/12 inches
Cutting straightness 2um Spindle speed (rpm/min) 6000-60000
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