The Taiyan TKP-600P board-level plasma etching machine efficiently executes processes such as cleaning, surface modification, activation, roughening, desmearing, and micro-etching for board-level products. Featuring a modular design, the equipment incorporates core components—including a highly stable vacuum chamber, a multi-channel precision gas mixing system, and an efficient vacuum pumping system—to ensure a stable and controllable process flow. It is compatible with organic substrates such as EMC, ABF, PET, and PI, as well as inorganic materials including glass, ceramics, SiO2, SiC, and silicon wafers; the system is capable of processing PCBs, IC carrier boards, and advanced packaging substrates with maximum dimensions of 600 × 600 mm.