Suzhou Takchip Semiconductor Co., Ltd.

TKP-500W

Fully Automated Wafer Plasma Etching Equipment
The Taiyan TKP-500W fully automated wafer plasma cleaning and etching system is primarily designed for wafer surface cleaning and pretreatment, offering compatibility with 6-inch, 8-inch, and 12-inch wafers simultaneously. The CORONA-500W system consists mainly of 6/8/12-inch wafer loading ports, a dual-arm wafer robot, an aligner, and a vacuum chamber module. It provides effective solutions for processes such as resist stripping and via cleaning, enhancing wafer adhesion, removing metal oxides, and relieving wafer stress.
Fully Automated Wafer Plasma Etching Equipment
Applications
Product Applications

EMC Trockenätzung

Plasma-Entgummierung

Si、SiC、ABF、Metall-Mikroätzung

Plasmareinigung von Wafern

Specifications
Specifications

Parameter

Content

Parameter

Content

Equipment Dimensions

1900 × 1500 × 2100 mm (L × W × H)

Process Gases

O₂, Ar, N₂, CF₄ (Spare)

Chamber Configuration

Side-Opening

Gas Inlet Method

Top Inlet

Wafer Size

8-inch (Compatible with 6-inch & 12-inch); Thickness ≥ 200 µm, Warpage ≤ 1 mm

Flow Meter Range

0–300 sccm

Power Supply Configuration

RF 1000W, 13.56 MHz

Vacuum Pump

Dry Pump

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