TKP-500W
|
Parameter |
Content |
Parameter |
Content |
|
Equipment Dimensions |
1900 × 1500 × 2100 mm (L × W × H) |
Process Gases |
O₂, Ar, N₂, CF₄ (Spare) |
|
Chamber Configuration |
Side-Opening |
Gas Inlet Method |
Top Inlet |
|
Wafer Size |
8-inch (Compatible with 6-inch & 12-inch); Thickness ≥ 200 µm, Warpage ≤ 1 mm |
Flow Meter Range |
0–300 sccm |
|
Power Supply Configuration |
RF 1000W, 13.56 MHz |
Vacuum Pump |
Dry Pump |