The Taiyan TMA-300 fully automated laser marking and flash removal system is primarily utilized in the field of IC packaging for laser marking processes and the removal of excess molding flash. The TMA-300 consists mainly of an automated loading/unloading mechanism, a vision inspection system, a marking positioning mechanism, a 2D code reading unit, and a cleaning and dust removal mechanism. Through quick and simple adjustments, the system is capable of processing workpieces ranging from 50 to 100 mm in width and 160 to 300 mm in length, and is adaptable to the marking and flash removal requirements of semiconductor devices, lead frames, substrates, and tray units composed of various materials—including metal, plastic, ceramics, and glass.