Laser Frame Cutting System TKP-100 - Suzhou Takchip Semiconductor Co., Ltd.

TKP-100

Laser Frame Cutting System TKP-100

The Taiyan TCA-100 Laser Leadframe Cutting System is a high-precision, intelligent processing device specifically designed for back-end semiconductor packaging processes. Its core function lies in the precise laser cutting of leadframes for package types such as QFN and DFN. The system integrates a high-precision laser cutting module, an intelligent CCD vision positioning system, and an adaptive vacuum clamping system; it supports the processing of workpieces in various sizes, delivering high cutting precision and a minimal heat-affected zone. Furthermore, it is equipped with efficient dust removal and safety protection systems to ensure a clean and secure processing environment.

Application

Product Applications

Laser-cut L/F Frame

Analysis of Cut Edges and Burrs

Specifications

Technical Specifications

Item	Content	Item	Content
Equipment Dimensions	3200 × 1450 × 1800 mm (L × W × H)	Processing Capability	Max. Working Area: 300 mm × 100 mm
Laser System	Laser Type: Fiber Laser (2-year warranty)		Applicable Product Dimensions: Length 160–300 mm / Width 25–100 mm
	Output Power: 150 W @ 1064 nm		Cutting Speed: X/Y Axes: 0.1–1000 mm/s (Industry-leading dynamic response)
	Frequency Range: 1 kHz – 2000 kHz (Finely Adjustable)	Intelligent Configuration	Loading/Unloading System: Magazine-type / Stacked Cassette (Optional) + Fully Automatic Metal Rail Width Adjustment
Precision Control	Positioning Accuracy: < ±0.01 mm (CCD Vision Positioning, 5 MP)		Error-Proof Design: CCD Vision Inspection of Strip Orientation
Precision Control	Axis Repeatability: X/Y Axes: ±0.003 mm; Z Axis: ±0.03 mm		ESD Anti-Static System: Brushes + Ion Fan