Suzhou Takchip Semiconductor Co., Ltd.

TKP-100G

All-Laser Grooving and Cleaning System TKP-100G
The Taiyan TLC-100G Laser Grooving and Cleaning System is a multi-functional device that integrates both laser grooving and cleaning capabilities. Employing high-energy pulsed laser technology, it enables precision processing at the micron level. Its operating principle involves utilizing laser ablation to etch precise grooves into the material surface, while simultaneously leveraging the laser's photothermal effect to instantly vaporize and remove surface contaminants (such as oxide layers or oil residues). The system primarily comprises a machine frame, an XY motion module, a Z-axis module, a vacuum fixture module, a CCD laser module, and an optional automatic loading/unloading module. It is widely applied in fields such as laser adhesive removal, hole drilling, cutting, and blind via formation for PCBs, carrier boards, and similar substrates.
All-Laser Grooving and Cleaning System TKP-100G
Application
Product Applications

Laser Glue Removal

Laser Hole Cutting

Laser Blind Slotting

Specifications
Technical Specifications

Item

Content

Item

Content

Overall Dimensions

1650mm (L) × 1550mm (W) × 1700mm (H)

 

 

 

Cutting Platform System

Linear Motor Platform; Dimensions: 550mm × 650mm

 

 

Laser System

Fiber Laser; Wavelength: 1064nm

Motion Range: 550mm × 650mm; Max. Speed: 1000mm/s; Max. Acceleration: 1G

Scanning Range: 100 mm × 100 mm

Positioning Accuracy: ±5 μm; Repeatability: ±3 μm

Repeatability: ±10 μm

Grooving Depth: ≤ 0.5 mm

CCD System

Positioning CCD: 5 Megapixels

Product Specifications

Max. Dimensions: ≤ 550 mm × 650 mm

Positioning Accuracy: < ±10 μm

Max. Thickness: ≤ 10 mm

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