Fully automatic laser cutting slotting & drilling - Suzhou Takchip Semiconductor Co., Ltd.

ADVANTAGES & FEATURES

Multi-size compatibility

Strong compatibility, adapting to workpieces of various sizes and shapes (50-100mm wide, 160-300mm long).
High precision and high reliability

The marking has high precision, fast speed and good stability, meeting the needs of high-quality continuous production.
Independent research and development of the whole machine

Independently develop equipment software and hardware systems to ensure stable and smooth operation of the equipment and more convenient maintenance.
Compliant with semiconductor standards

Support SECS/GEM, two-year log traceability; with processing report, alarm indication and solution prompts and other functions.
Automation and high efficiency

The equipment is fully automatic in production, has high processing efficiency, and has product traceability capabilities.

Advanced packaging special-shaped cutting

It can be applied to advanced packaging cutting including SIP, Fanout, and 3D.

Such as A/H watch special-shaped cutting, Apple TWS earphone cutting, fingerprint module, camera module, automotive electronic module, SD card, PCB/FPCB/PI film cutting; EMC cutting/grooving; QFN cutting/grooving/filling

Laser drilling (TMV)

The laser drilling process can form vias on plastic packaging or silicon materials to achieve three-dimensional packaging of multi-layer chips.

The shape/size or aspect ratio of the vias can be controlled by controlling the characteristics of the laser drilling process (eg, power, area, duration, etc.).