Fully automatic laser flash removal - Suzhou Takchip Semiconductor Co., Ltd.

ADVANTAGES & FEATURES

Multi-size compatibility

Strong compatibility, adapting to workpieces of various sizes and shapes (50-100mm wide, 160-300mm long).
High precision and high reliability

The marking has high precision, fast speed and good stability, meeting the needs of high-quality continuous production.
Independent research and development of the whole machine

Independently develop equipment software and hardware systems to ensure stable and smooth operation of the equipment and more convenient maintenance.
Compliant with semiconductor standards

Support SECS/GEM, two-year log traceability; with processing report, alarm indication and solution prompts and other functions.
Automation and high efficiency

The equipment is fully automatic in production, has high processing efficiency, and has product traceability capabilities.

Laser flash removal case

Laser flash removal technology uses the high peak power of laser pulses to instantly vaporize the flash, removing it from the IC packaging strip.

Compared with the high-pressure water jet process and the high-pressure water sandblasting process, the laser overflow removal process does not require subsequent processing steps such as chemical softening and high-pressure water jetting. It is efficient, reliable, and environmentally friendly.