Suzhou Takchip Semiconductor Co., Ltd.
TKP-E Series

ETCH TGV AOI Inspection Equipment TKP-E Series
ETCH TGV AOI Inspection Equipment TKP-E Series

Measures Top, Bottom and Waist aperture dimensions simultaneously without the need to turn the workpiece over

Maximum glass dimensions: 510mm x 515mm; measurement completed within 15 minutes

DXF comparison for rapid modelling and measurement verification

Custom thresholds for generating NG MAP

Dynamic distribution display of measurement values on a map

Automatic comparison of single-wafer cuts

Output of production data statistics

Quick display of defect screenshots

Defect screenshot display list

Change specification conditions and re-export without re-measuring

Compatible with positive cones, inverted cones, straight cylinders and funnel-shaped holes

UniDRON-Semi Technology


TKP-E SeriesSpecification Sheet

Sample Styles

TGV GLASS AFTER ETCH

Dimension Range

MAX 510mm ×  515mm,

 Thickness 0.1mm–1mm

Inspection Items

TGV HOLE Measurement

Inspection method

Line scan

Camera resolution

6K

Inspection Accuracy

3.5µm or 1.75µm

External dimensions

2000 × 2000 × 2200 mm

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