Suzhou Takchip Semiconductor Co., Ltd.
TKP-L Series

TKP-L Series Laser-Modified Product Inspection Machine
In the TGV process, the first step involves laser modification; the quality of this modification has a significant impact on the uniformity and quality of the subsequent etched holes. This technique involves inspecting the uniformity of the energy intensity following laser treatment, identifying any missed or over-treated areas and their locations, to ensure that the quality of the laser modification does not compromise the subsequent etching process.
TKP-L Series Laser-Modified Product Inspection Machine
Modification inspection/measurement items:

1. Omission of modification points

2. Over-treatment of points

3. Coordinate deviation of treatment points

4. Uniformity of treatment

5. Total point count statistics

6. Display of missed point locations and quantities

7. Display of duplicate point locations and quantities

8. Automatic contamination filtering function

UniDRON-Semi Technology


TKP-L SeriesSpecification Sheet

Sample Styles

TGV LASER MODIFICATION MEASUREMENT

Dimension Range

MAX 510mm × 515mm,

Thickness 0.1mm–1mm

Inspection Items

Missed marks, over-etching, positional deviation,

Uneven modification, differences in modification between upper and lower surfaces

Inspection method

Line scan

Camera resolution

6K

Inspection accuracy

3.5µm

External dimensions

2000 × 2000 × 2200 mm

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