Wafer transfer, handling and cassette conversion equipment for sectors such as semiconductor substrates, chips, advanced packaging, integrated circuits and next-generation displays.
Wafer transfer, handling and cassette conversion equipment for sectors such as semiconductor substrates, chips, advanced packaging, integrated circuits and next-generation displays.
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TKP-SP Series Specification Table |
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Inspection Object Dimensions |
4/6 or 6/8 or 8/12 inch |
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Sample material |
Si/SiC/GaAs/GaN/InP/Glass/Sapphire etc |
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Specimen thickness |
300μm–1000μm |
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Workpiece warpage |
≤1mm (≤5mm with End Effector) |
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External dimensions |
2990 x 2330 x 1890 mm |
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Cassette |
Open/SMIF/FOUP/FOSB/Metal Cassette |
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Transfer Method |
Fork / Edge |
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Cassette Capacity |
2–4 |