Suitable for applications in fields such as semiconductor substrates, chips, advanced packaging, integrated circuits and next-generation displays, this system, when paired with a metallographic microscopy optical system, enables manual or automated macro- and micro-inspection of both sides of wafers. A DUV optical system can be selected to perform CD measurement. An infrared (IR) optical system can be selected to enable through-wafer inspection. KLAF/Bin Map files can be imported to facilitate automated image capture, grading and export.