TKP 300A Semiconductor Wafer Inspection System - Suzhou Takchip Semiconductor Co., Ltd.

TKP 300A

TKP 300A Semiconductor Wafer Inspection System

· Suitable for 12-inch Notch wafers
· 8-inch SEMI 25-wafer open-frame cassettes
· 12-inch FOUP & FOSB cassettes
· Optional AI automatic defect detection function
· SECS/GEM communication protocols
· Optional DUV optical system for CD measurement
· Optional infrared (IR) optical system
· Wafer Map function as standard
· KLAF/Bin Map files can be imported

UniDRON-Semi Technology

TKP 300A Specification Table
Specimen dimensions	8/12 inch
Specimen material	Si/SiC/GaAs/GaN/InP/Glass/Sapphire etc
Specimen thickness	350–1000 μm
Specimen warpage	≤1 mm (≤3 mm with End Effector)
Macro/micro observation accuracy	Min 150–500 μm / 300 nm–1 μm
External dimensions	1800 x 2000 x 2000 mm
Cassette	8-inch: Open Cassette via info pad 12-inch: FOUP/FOSB Detect
Cassette handling	2