In fields such as semiconductor substrates, chips, advanced packaging, integrated circuits and new display technologies, this system is paired with a metallographic microscopy optical system to enable manual or automated macro and micro inspection of both sides of wafers.
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TKP 300MSpecification Table |
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Object Dimensions |
8/12 inch |
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Sample material |
Si/SiC/GaAs/GaN/InP/Glass/Sapphire etc |
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Specimen thickness |
350–1000 μm |
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Specimen warpage |
≤1 mm (≤3 mm with End Effector) |
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Macro/Micro Observation Accuracy |
Min 150–500 μm / 300 nm–1 μm |
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External dimensions |
1885 × 1817 × 1847 mm |
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Cassette |
8-inch: Open Cassette via info pad 12-inch: FOUP / FOSB Detect |
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Cassette capacity |
1 |
